The IOM777 is a processor PMC / XMC module powered by an AMD Zynq-7000 SoC, which integrates an ARM Cortex-A9® (dual or single-core), and high-performance FPGA fabric, delivering a powerful combination of software programmability and hardware acceleration.

In combination with a carrier board, the IOM777 is designed for seamless integration into a variety of platforms, including VME, VPX, CompactPCI, and PCI Express. It offers I/O interfaces such as Gigabit Ethernet, PCI 3.0 / PCIe Gen1, CANbus, UART and JTAG (for debugging purposes). Furthermore the IOM777 has 40 freely configurable GPIO pins to the backplane, which can be configured for various interfaces, such as I2C, UART and SPI.

This processor PMC / XMC module is not only high-performing but also cost-effective, making it an excellent solution for low-budget applications without sacrificing flexibility or computing power. The reconfigurable FPGA fabric enables custom processing algorithms and hardware acceleration, making it perfect for applications like signal processing, image processing and data acquisition.

The IOM777 is specifically engineered to excel in the most demanding and rugged conditions. The power-efficient architecture is making it very suitable for power-constrained embedded applications. Built to handle extreme environments, it operates flawlessly in temperatures ranging from -40°C to +85°C. The IOM777 comes in an air- and conduction-cooled variant and conformal coating is available on request.

Extensive software support is offered through tools like Vivado for hardware and software co-design, along with support for Linux and custom FPGA firmware development. This ensures that developers can efficiently leverage both the ARM processor and FPGA to meet the needs of diverse and demanding embedded system applications.